Independent guides, manufacturing analyses, and technical explainers across all hardware disciplines.
Emerson says its Rosemount QX1400 gas analyzer holds ATEX and IECEx approvals, with North American Class I, Division 2 still expected. What that means for US projects.
HARTING says Han Size 4 carries up to 70 A in a smaller housing. Which space and weight figures apply to which configuration, and what rail designers still need to confirm.
What Micro-Epsilon has published about profileGAUGE C.ODC, which specs carry conditions, and the files, wiring and settings to prepare before connecting it to a PLC.
Convection, infrared and vapor-phase reflow ovens compared, plus batch versus conveyor formats and a five-step way to choose an oven category for your boards.
How reflow soldering works, what the preheat, soak, reflow and cooling stages do, which J-STD-020 limits apply, and which defects trace back to the profile.
Choose solder paste in three decisions: alloy, powder type (Type 3, 4 or 5) matched to stencil apertures, and flux class matched to your cleaning process.
Teledyne FLIR's Prism A-ISR airborne AI software: the compute platforms, cameras, power and outputs it lists, how to read its detection specs, and what to ask before integrating.
Compare wave, reflow, selective and hand soldering for mixed-technology boards, see where each one struggles, and assign a process to each part in four questions.
