How to Verify an STM32 Watchdog Reset and Preserve the Evidence
Save the reset flags before startup clears them, then run a no-refresh test with the debugger disconnected. Copy the timeout from your MCU manual.
FEATURED DISPATCHEmbedded Systems
DDR3 and DDR4 EOL Dates: A Part-Number PCN Checklist
A broad memory phaseout headline can send a BOM review in the wrong direction. Check the exact part number, purchase deadline and shipment deadline separately.
JTAG vs SWD: Choose Debug Access Without Losing Board Test Options
Dropping TDI and TDO can force a rework if the fixture still needs a scan chain. Match the chip, the probe, and the connector before you delete pins.
I2C Pull-Up Resistors With Multiple Devices: Audit the Whole Bus
Several modules on one I2C bus add their pull-ups in parallel. Audit each resistor, then check the result against sink current and rise time.
Solder Paste Storage and Handling: A Lot-by-Lot Checklist
Record each solder paste container from receiving through warm-up, printing and leftover disposition. Copy storage limits from that product's datasheet.
Jabil FY2026 Results: What They Tell EMS Engineers and Buyers
Read Jabil's preliminary FY2026 results by period and accounting basis, distinguish FY2027 outlook, and turn company signals into project questions.
KYZEN's Penang Expansion: What It Signals for Electronics Assembly
KYZEN's Penang headquarters and production announcement, its implications for assembly teams, and the delivery and process questions that remain open.
Emerson QX1400 Certification Tracker: What Is Certified Now and What Is Still Pending
Emerson says its Rosemount QX1400 gas analyzer holds ATEX and IECEx approvals, with North American Class I, Division 2 still expected. What that means for US projects.
HARTING Han Size 4 for Rail: Weight and Space Claims, Read Carefully
HARTING says Han Size 4 carries up to 70 A in a smaller housing. Which space and weight figures apply to which configuration, and what rail designers still need to confirm.
Integrating a Dual-Axis Optical Micrometer Over EtherCAT or PROFINET: Notes on profileGAUGE C.ODC
What Micro-Epsilon has published about profileGAUGE C.ODC, which specs carry conditions, and the files, wiring and settings to prepare before connecting it to a PLC.
Reflow Oven Types and How to Choose One for PCB Assembly
Convection, infrared and vapor-phase reflow ovens compared, plus batch versus conveyor formats and a five-step way to choose an oven category for your boards.
Reflow Soldering Explained: Process Stages and Temperature Profile
How reflow soldering works, what the preheat, soak, reflow and cooling stages do, which J-STD-020 limits apply, and which defects trace back to the profile.
How to Choose Solder Paste: Powder Types, Alloys and Use Cases
Choose solder paste in three decisions: alloy, powder type (Type 3, 4 or 5) matched to stencil apertures, and flux class matched to your cleaning process.
Prism A-ISR on Orin and Qualcomm 8550: An Embedded Integration Checklist From FLIR's Published Specs
Teledyne FLIR's Prism A-ISR airborne AI software: the compute platforms, cameras, power and outputs it lists, how to read its detection specs, and what to ask before integrating.
Wave vs Reflow vs Selective vs Hand Soldering: How to Choose
Compare wave, reflow, selective and hand soldering for mixed-technology boards, see where each one struggles, and assign a process to each part in four questions.